SuperServer

DP Intel 2-OU (OCP ORV3) Liquid-Cooled System with NVIDIA HGX B300 8-GPU (complete rack and onsite service are required)

Integrated Board: X14DBG-LC2

Key Applications

  • HPC
  • AI/Deep Learning Training
  • Artificial Intelligence
  • Deep Learning Inferencing
  • LLMs & Multi-modal LLMs

Key Features

  1. 21” OCP ORV3 Rack compatible, 1400A busbar with power shelves, DC-SCM Support
  2. Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
  3. NVIDIA HGX B300 8-GPU with 5th Generation NVLink® 1.8TB/s, 2.3TB of HBM3e GPU memory per system
  4. 8x NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s, up to two NICs for North/South traffic
  5. 32x DIMMs with up to 8TB at 5200MT/s or up to 4TB at 6400MT/s DDR5 RDIMM
  6. 8x Hot-swap E1.S NVMe storage drive bays and 2x M.2 NVMe boot drives
  7. 2x 10GbE RJ45 via AIOM card
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SYS-222GS-NB3OT-ALC
Specifications Free Remote Testing Resources & Downloads
Specifications
Product SKUs
SuperServer SYS-222GS-NB3OT-ALC
Motherboard
Super X14DBG-LC2
Processor
CPU
Core Count
  • Up to 86C/172T; Up to 335MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Liquid Cooled)​
GPU
Max GPU Count
  • 8 onboard GPUs
Supported GPU
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • NVIDIA® NVLink™ with NVSwitch™
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 5200MT/s ECC DDR5 RDIMM
  • 查看内存选项
Memory Voltage
  • 1.1V
On-Board Devices
Chipset
  • System on Chip
Network Connectivity
Input / Output
LAN
  • 2 RJ45 10 GbE LAN ports (Intel® X710)
  • 8 OSFP 800 Gb/s InfiniBand LAN ports (NVIDIA ConnectX®-8 SuperNIC)
  • 1 RJ45 1 GbE Dedicated BMC LAN port (ASPEED AST2600) (via DC-SCM)
Video
  • 1 VGA port(Front)
  • 1 Mini-DP port(Front)
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 64MB UEFI
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2-OU Rackmount
Model
  • CSE-GP202TS-000NP
Dimensions and Weight
Height
  • 3.7" (94 mm)
Width
  • 21.1" (537 mm)
Depth
  • 31.69" (805 mm)
Package
  • 13.15" (H) x 29.5" (W) x 51.18" (D)
Weight
  • Gross Weight: 176 lbs (80 kg)
  • Net Weight: 154 lbs (70 kg)
Available Color
  • Silver
Front Panel
LED
  • Network activity LEDs
  • UID
Buttons
  • Power On/Off 
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 8 bays
    • 8 front hot-swap E1.S NVMe drive bays
M.2
  • 2 M.2 NVMe slots (M-key; RAID support via S3808N controller)
System Cooling
Fans
  • Up to 4 Fan 80mm Fan(s)
  • Up to 4 Fan 40mm Fan(s)
Air Shroud
  • 3 Air Shrouds
Liquid Cooling
  • Direct to Chip (D2C) Cold Plate
Power Supply
Power via Busbar (48-52V DC)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Free Remote Testing

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