2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 140W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Supports system management utility, Monitors CPU voltages, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, 8 -fan status
LED
UID/remote UID LED
CPU/system overheat LED
Temperature
CPU thermal trip support
PECI
FAN
8x 4-pin fan headers (up to 8 fans)
PWM fan speed control
Overheat LED indication
Other Features
UID, Node manager support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, ATX power connector, ACPI power management, SDDC
1U Passive Proprietary CPU Heat Sink for X11DPL Motherboard Equipped with a Square Retention Mechanism 2U Active CPU Heat Sink Supporting Square Bolster Plate Mounting Mechanism for X11DPL in 2U and Above Systems
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
