SuperServer SYS-322GA-NR

3U Intel DP Edge Data Center System with Up to 10 PCIe 5.0 x16 slots + Up to 14 E1.S NVMe Drives

SYS-322GA-NR メイン SYS-322GA-NR アングル SYS-322GA-NRトップ SYS-322GA-NR フロント SYS-322GA-NR リア SYS-322GA-NR Opt1 SYS-322GA-NR Opt2 SYS-322GA-NR Opt3 SYS-322GA-NR Opt4 SYS-322GA-NR Opt5
Integrated Board: X14DBG-XAP
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Key Applications

  • High Performance Computing
  • AI/Deep Learning Training
  • Industrial Automation, Retail
  • Healthcare
  • Conversational AI
  • Business Intelligence & Analytics
  • Drug Discovery
  • Climate and Weather Modeling
  • Finance & Economics
  • Edge AI Inferencing

Key Features

  1. Dual Intel® Xeon® 6900-Series Processors with P-cores up to 500W
  2. 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 6TB 8800MT/s DDR5 MRDIMM
  3. Up to 10 PCIe 5.0 x16 FHFL or 20 PCIe 5.0 x8 FHFL slots
  4. 6/8/14 hot-swap E1.S NVMe drive bays or 2/4/6 hot-swap 2.5" NVMe drive bays
  5. 3x 3200W or 2700W Redundant (2+1) Titanium Level power supplies
  6. Support up to 8 Double Width Full Height Full Length GPU or 19 Single Width GPU
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SYS-322GA-NR
Specifications Free Remote Testing Resources & Downloads Parts List
Specifications
Product SKUs
SuperServer SYS-322GA-NR
Motherboard
スーパーX14DBG-XAP
Processor
CPU
Core Count
  • 128C/256T; 504MB Cache per CPU
Note
  • Supports up to 500W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 8 double-width or 19 single-width GPUs
Supported GPU
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect
  • NVIDIA® NVLink® Bridge (optional)
System Memory
Memory
  • Slot Count: 24 DIMM slots/1 Channels
  • Max Memory (1DPC): 6TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (1DPC): 6TB 8800MT/s ECC DDR5 MRDIMM
  • メモリオプションを表示
Memory Voltage
  • 1.1V
On-Board Devices
Chipset
  • System on Chip
Network Connectivity
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB
  • 2 USB 3.2 Gen1 Type-A ports
Video
  • 1 VGA port
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 64MB SPI Flash EEPROM
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 3U Rackmount
Model
  • CSE-MX301TS-R0NDFP
Dimensions and Weight
Height
  • 5.2" (132.1 mm)
Width
  • 17.26" (438.4 mm)
Depth
  • 31.5" (800 mm)
Package
  • 13" (H) x 29" (W) x 47" (D)
Weight
  • Gross Weight: 70.4 lbs (32 kg)
  • Net Weight: 135 lbs (61.24 kg)
Available Color
  • Silver
Front Panel
LED
  • Universal Information (UID) LED
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 8 PCIe 5.0 x16 (in x16) FHFL double-width slots
  • Option A*
    • 8 PCIe 5.0 x16 (in x16) FHFL double-width slots
    • 2 PCIe 5.0 x16 (in x16) FHFL slots
  • Option B*
    • 20 PCIe 5.0 x8 (in x16) FHFL slots
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
  • AOCオプションを見る
CXL Support
  • Up to 17 CXL 2.0 x16/x8 devices
M.2
  • 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 22110(default)/2280)
Drive Bays / Storage
Drive Bays Configuration
  • Option A: Total 6 bays
    • 6 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays
  • Option B: Total 14 bays
    • 14 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays
  • Option C: Total 2 bays
    • 2 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays
  • Option D: Total 4 bays
    • 4 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays
  • Option E: Total 6 bays
    • 6 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bays
  • (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)
  • NVMeオプションを見る
M.2
System Cooling
Fans
  • 5 Front 8cm Fan(s)
  • 6 Internal 6cm Fan(s)
Air Shroud
  • 1 Air Shroud
Power Supply
3x 3200W
3x 3200W Redundant (2 + 1) Titanium Level (96%) Hot-plug power supplies
Dimension (WxHxL)73.5 x 40 x 185 mm
Input3200W: 0240Vdc / 50-60Hz (for CQC only)
1000W: 100-127Vac / 50-60Hz
2900W: 200-207Vac / 50-60Hz
3000W: 207-220Vac / 50-60Hz
3200W: 220-240Vac / 50-60Hz
+12VMax: 82A / Min: 0A (100Vac-127Vac)
Max: 237.7A / Min: 0A (200Vac-207Vac)
Max: 245.9A / Min: 0A (207Vac-220Vac)
Max: 262.3A / Min: 0A (220Vac-240Vac)
12V SBMax: 3A / Min: 0A
Output TypeBackplanes (gold finger)
3x 2700W
3x 2700W Redundant (2 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL)73.5 x 40 x 185 mm
Input2700W: 200-240Vac / 50-60Hz
2700W: 240-240Vdc / 50-60Hz (for CQC only)
+12VMax: 225A / Min: 0A (200Vac-240Vac)
Max: 225A / Min: 0A (240Vdc-240Vdc)
12V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Free Remote Testing

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スケジュール アクセス
Resources & Downloads
Parts List
Optional Parts List
Part Number Qty Description
8x SATA optional sets CBL-GNZ2-1221MTS4 1 GenZ 2C+2 mount holes to SlimSAS x8,21cm,31AWG,RoHS
MCP-220-00147-0B • 5 Black gen-3 hot-swap 2.5" Tool-less HDD tray (clip design)
Side expention sets AOM-DP801-PCIE-P 1 NIC Riser board(After Mid-Plane) for Delta-Next GPU System,RoHS
AOM-DP801-SW-P 1 NIC adaptor board with PLX switch for Delta-Next GPU system,RoHS
CBL-PWEX-1142B-40 • 1 MicroHi(2x4 to 2x4), PH3.0, 40cm, 8.5A/p, 18AWG, RoHS
CBL-MCIO-1255M5 • 4 MCIO x8 (STR to STR),55CM,30AWG,RoHS

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