2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots
1 PCIe 3.0 x32 Left Riser Slot, 1 PCIe 3.0 x8 Center Right Riser Slot, 1 PCIe 3.0 x40 Far Right Riser Slot, 4 PCIe 3.0 NVMe x4 Internal Port(s)
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
Core
Up to 28 cores
Note
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory
Memory Capacity
16 DIMM slots
Up to 4TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 4TB 3DS ECC RDIMM, DDR4-2933MT/s
Power-on mode for AC power recovery, ACPI Power Management
PC Health Monitoring
Voltage
Monitors CPU voltages, +5V standby, +5V, +3.3V, +12V
LED
UID/remote UID LED
Power LED
BMC/IPMI Heartbeat LED
CPU/system overheat LED
Temperature
Monitoring for CPU and chassis environment
CPU thermal trip support
Support to monitor Supermicro AOC temperatures from IPMI or SD 5
Thermal Control for 8 Fan Connectors
FAN
8x 4-pin fan headers (up to 8 fans)
PWM fan speed control
Other Features
UID, RoHS, Node manager support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, ATX power connector, ACPI power management, SDDC, Hyper-Speed Technology hardware acceleration
